Holographic Interferometry

More Applications

HI is applicable to many other development and production test tasks

Home PageHI ExperienceStress AnalysisMore Applications
 nMechanical and Structural Analysis
Transducers and Control
Composite Materials and Structures
Mechanical and Vibration Analysis
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Electronic Components
Operational and Thermal Analysis
PC Board Structure and Material
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Design and Analysis
Localized and Residual Stress
Pressure, Thermal, Flow induced stress
Bonding, Porosity, and Coatings